PART 2
Part 1 consisted of dismantling of the major
components that made up the product architecture on the bottom half of the
laptop. This post will be a start of the dismantling of the subassembly
components. I emphasize "start".
13. Hard drive intact: underneath, all components soldered or bonded components
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14. Hard drive dismantled: metal cover, PCB,
drive and fasteners
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15. Hard drive: PCB, as typical for PCBs, all soldered or bonded components
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16. Hard drive dismantled (other sides): metal cover, PCB, drive
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17. Hard drive (other side): PCB
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18. Hard drive (other side): drive
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21. Main PCB: aluminum and copper heatsinks etc. separated
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22. Main PCB (other side), numerous soldered and bonded components
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23. Aluminum heatsink, highly pure aluminum
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24. Aluminum heatsink (other side)
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26. Bottom assembly, components
dismantled and removed parts shown separated, parts from above photos:
26.1 Panels removed and
exposing under carriage (center and left)
- upper control
board and speaker grill panel (right)
-
mainboard:
~
disk drive (top right)
~
main PCB (middle)
- hard drive
(top left of PCB main assembly)
- bottom plastic
cover of laptop (left: gray rectangular plastic molded)
- battery pack
(bottom right)
- hard drive
panel (top middle left)
- memory card
panel (bottom middle left)
- numerous fasteners
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28. Hard drive dismantled: outside
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29. Bottom cover of laptop: outside
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1. (1st photo again) Not done yet by a long shot. Here, it
looks so uncomplicated.
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These are the same components (from Part 1) removed and separated
from each other with their subassemblies taken apart. This is just for the
bottom portion of the laptop. After many dismantling efforts:
- Time in Part 1, average was 3min. I could have been exact to the second, but in reality, it would vary. If you want specific times, see there many publications on it. There are 100s on:
www.ActiveDisassembly.com (publications) related to this topic and future technology in 'Design for Disassembly; (DfD).
- Time here in Part 2: 5min. As in Part 1., this is mainly due to the
amount of machine screws and complexity. I had the proper tools and 2 power drills with correct bits in place. To get consistently under 5min would require mechanized or robotic systems. Alternatively DfD and www.ActiveDisassembly.com, which could do it in fractions of a second with batch processing.
Conclusions (similar issues as in Part 1)
Design issues:
- too many screws (dozens), more than in Part 1, in this next level of dismantling
- too many snap fits that make it hard not to break the subassemblies - snap fits are usually better than screws
- non-obvious disassembly
- mixed materials
- complexity
- numerous brass captain bolts molded into injection molding
- non-standardized screws
- under spec polymer casings (warping, cracking and wear)
- glued labels
- too time-consuming and complex for repair (PCB and battery pack etc.)
~ batter pack is bonded to ensure closure, contains high grade materials
- too time-consuming for upgrade (memory board, hard drive etc.)
Even with numerous snap fits, they were breakable and at times required cracking of the assembly in order to open parts apart. Overlapping of components was still somewhat minimal as in Part 1. There are still many insulating materials mixed in with others.
I will go into the next level of detail in subsequent posts.
In the next post, I'll finish the bottom half macro disassembly of its subassemblies.
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