Showing posts with label Eco-Design. Show all posts
Showing posts with label Eco-Design. Show all posts

Monday, April 7, 2014

PhoneBloks: in more detail


This post has been taken from here, DeZeen.
http://www.dezeen.com/2013/10/19/phonebloks-mobile-phone-concept-by-dave-hakkens

Stay tuned for the next post where we will investigate examples of this getting much closer to market than you think!


For related resources, Design for Disassembly, Eco-Design, Environment and AD Technology guidelines related to this can be downloaded for free at:













Phonebloks mobile phone concept
by Dave Hakkens

 

Dutch Design Week 2013: Design Academy Eindhoven graduate Dave Hakkens' concept for a mobile phone made of detachable blocks has gone viral, attracting over 16 million views on YouTube and garnering almost a million supporters online (+ movie + interview).


Dave Hakkens - Phone Bloks on Vimeo

vimeo.com/76319190
from Design Academy Eindhoven 
Phonebloks by Dave Hakkens
"I put the video online and in the first 24 hours I had like one million views on YouTube," Hakkens told Dezeen. "I got a lot of responses to it."
Phonebloks by Dave Hakkens
Dutch designer Hakkens, who graduated from Design Academy Eindhoventhis summer, presented his Phonebloks concept at the academy's graduation show in Eindhoven today at the start of Dutch Design Week.
Phonebloks by Dave Hakkens
Phonebloks is a concept for a phone made of swappable components that fit together like Lego, with each component containing a different function. This means that components can be replaced or upgraded without having to throw away the phone.
Phonebloks by Dave Hakkens
"Usually a phone is integrated into one solid block and if one part gets broken you have to throw away the entire phone," said Hakkens. "But this has different components, so if  your battery is broken you can replace the the battery or if you need a better camera you only upgrade the camera component. So you don't throw away the entire phone; you keep the good stuff."
Last month Hakkens uploaded a video explaining the concept to YouTube, where it went viral and has now been watched over 16 million times.
He then put the idea on "crowdspeaking" site Thunderclap, where instead of donating money, supporters donate their social reach. He now has over 900,000 supporters on the site, and when the campaign closes on 29 October a message about Phonebloks will automatically be sent to each supporters' social media contacts, giving Hakkens a total audience of over 360 million people.
Hakkens said: "That's the whole point of this idea; to generate lots of buzz so companies see there's a huge market and realise they really need to make a phone like this."
The Phonebloks concept features electronic blocks that snap onto a base board, which links all the components. Two small screws lock everything together. Users can choose components from their favourite brands or make their own modules.
"You can customise your phone, replacing the storage block with a larger battery if you store everything in the cloud, or replace advanced components you don't need with basic blocks like a bigger speaker," says the video explaining the concept.
Hakkens hopes Phonebloks will lead to fewer phones being thrown away, thereby reducing waste. "Electronic devices are not designed to last," the video says. "This makes electronic waste one of the fastest-growing waste streams in the world and our phone is one of the biggest causes."
Here's the interview conducted at Design Academy Eindhoven today:

Marcus Fairs: What is Phonebloks?
Dave Hakkens: Phonebloks is a phone made to upgrade and repair; it's a phone worth keeping. Usually we throw it away after a couple of years. But this one is made to last.
Marcus Fairs: How is it made to last?
Dave Hakkens: Usually a phone is integrated into one solid block, and if one part gets broken you have to throw away the entire phone. But this has different components, so if for instance only your battery is broken you can replace the the battery, or if it's slow after a couple of years you can change just the speed component. If you need a better camera you only upgrade the camera component. So in this way you don't throw away the entire phone; you keep the good stuff.
Marcus Fairs: Tell us how it went viral.
Dave Hakkens: The idea with this whole project is I'm just one guy at the Design Academy; I can't make this phone by myself. I can go to a lot of companies and pitch, ask them if they'd like to make my phone, but I thought I'd do it the other way around; so I gathered a lot of people who told companies they really wanted this phone. So I put this video online and in the first 24 hours I had like one million views on YouTube. I also gathered supporters so currently I have 900,000 supporters, and they all just wanted this phone. So now I have all this attention and I get a lot of nice emails from companies who want to work on this.
Marcus Fairs: How did you spread the message?
Dave Hakkens: You have this site called Thunderclap. On Thunderclap instead of crowdfunding you crowdspeak people; people don't donate money but instead they donate their friends and family. You say you're interested in a project and want to support it, so you donate your friends - their Facebook followers and Twitter followers - and on the 29 October automatically a message is sent out by those people saying "We want Phonebloks". That spreads to all their friends and families. So currently I have like 900,000 supporters but on 29 October we will reach 300 million people. So that's the whole point of this idea; to generate lots of buzz so companies see there's a huge market and realise they really need to make a phone like this.
Marcus Fairs: What is the next step?
Dave Hakkens: My idea succeeded from day one; I got a lot of responses to it. I've got a lot of people interested in developing it: engineers, technicians and companies. So right now I'm thinking what would be a logical next step. Crowdsource it on the internet? Work together with a company? That's what I'm thinking about now; how to realise the phone the best way.

Friday, February 28, 2014

Phonebloks

Phonebloks


This can be considered a mastery of 'Design for Modules' (DfMod). This is a great example of 'Design for Disassembly' (DfD) Concept. If this can make the market, this will be a great interpretation of Eco-Design.

The original posting was in Sept, 2013:

For related resources, Design for Disassembly, Eco-Design, Environment and AD Technology guidelines related to this can be downloaded for free at:


Phonebloks - The Ultimate phone concept

https://www.youtube.com/watch?v=CfK-7lp-DhU


A new website has recently been introduced:
https://phonebloks.com/en
http://phoneblocks.com/gallery/



phonebloks-backside


phonebloks-pieces


phonebloks-all-comes-together


And more recently, end of Oct 2013,


Phonebloks - The next step in building a phone for the future
https://www.youtube.com/watch?v=3WOayh9gaHA

So excited to see what the future brings!

For related resources, Design for Disassembly, Eco-Design, Environment and AD Technology guidelines related to this can be downloaded for free at:

Saturday, November 2, 2013

Ellen Macarthur Foundation & The art of design for disassembly

This is a good introduction to 'Design for Disassembly' (DfD) and the 'Circular Economy' (CE) from an article written by Colin Wester at the Ellen Macarthur Foundation:

Chapter 1: The art of design for disassembly

Page 3 has a mention on 'Active Disassembly' (AD).


Design for Disassembly and other guidelines related to this can be downloaded for free at:
http://www.activedisassembly.com/strategy/


For related resources, Design for Disassembly, Eco-Design, Environment and AD Technology guidelines related to this can be downloaded for free at:

Monday, June 11, 2012

Laptop Disassembly - As complex as they get. Part 3

PART 3


Part 1 consisted of dismantling of the major components that made up the product architecture on the bottom half of the laptop.  Photos 1 - 12.

Part 2  consisted of the start of the dismantling of the subassembly components. I emphasize "start". Photos 13 - 29.

See all of these photos (1 - 37) in high definition in a matrix at www.ActiveDisassembly.com.

Part 3, below, consists of continuing on with the dismantling of the subassembly components. Images 30 - 37 described below.





30. Outside casing: close-up of upper control board with speaker grill panel
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31. Outside casing: close-up of upper control board with speaker grill panel and main keyboard removed
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32. Outside casing and keyboard: base portion of laptop, upside down, view of inside of the top of the top cover of that laptop base (opposite of where the keyboard sits).
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33. Outside casing and keyboard: base portion of laptop, upside down, view of inside of the top of the top cover of that laptop base (opposite of where the keyboard sits). Components in tact including copper heat transfer, main PCB, fan, volume and media control PCB etc.
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34. Laptop base: close-up of top right where volume and media control of upper control board sit with speaker grill panel (and main keyboard) removed
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35. Laptop base: as above in (34), opposite side of volume and media control PCB exposing opposite side of speaker.
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36. USB, speaker and mic input board: from underneath of top portion of base, front right
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37. USB, speaker and mic input board: from top of PCB as from above.
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--------------------------------------------------------------------------------------------
Note the assembly dismantled:



26.  (Recap) Bottom  assembly, components dismantled and removed parts shown separated, parts from above photos:

     26.1 Panels removed and exposing under carriage (center and left)
          - upper control board and speaker grill panel (right)
          - mainboard: 
             ~ disk drive (top right)
             ~ main PCB (middle) 
          - hard drive (top left of PCB main assembly)
          - bottom plastic cover of laptop (left: gray rectangular plastic molded)
          - battery pack (bottom right)
          - hard drive panel (top middle left)
          - memory card panel (bottom middle left)
          - numerous fasteners
---



1.  (1st photo again)  Note the original product.
---


Some of these are the same components (from Part 1) removed and separated from each other with their subassemblies taken apart. This is just for the bottom portion of the laptop.  After many dismantling efforts, to recap:

- Time in Part 1, average was 3min. 
  
- Time in Part 2: 5min. As in Part 1., this is mainly due to the amount of machine screws and complexity. I had the proper tools and 2 power drills with correct bits in place. To get consistently under 5min would require mechanized or robotic systems. Alternatively DfD and www.ActiveDisassembly.com, which could do it in fractions of a second with batch processing.


- Time here in Part 3, average was 3min.  As in above, the similar parameters apply. If you want specific times, see there many publications on it. There are 100s on:
www.ActiveDisassembly.com (publications) related to this topic and future technology in 'Design for Disassembly; (DfD).
Conclusions (similar issues as in Part 1 and Part 2)
Design issues:
- too many screws (dozens), more than in Part 1, in this next level of dismantling

- too many snap fits that make it hard not to break the subassemblies - snap fits are usually better than screws

- non-obvious disassembly 

- mixed materials

- complexity

- numerous brass captain bolts molded into injection molding
- non-standardized screws
- under spec polymer casings (warping, cracking and wear)
- glued labels
- too time-consuming and complex for repair (PCB and battery pack etc.)
  ~ batter pack is bonded to ensure closure, contains high grade materials
- too time-consuming for upgrade (memory board, hard drive etc.) 


Even with numerous snap fits, they were breakable and at times required cracking of the assembly in order to open parts apart. Overlapping of components was  still somewhat minimal as in Part 1. There are still many insulating materials mixed in with others.



I will go into the next level of detail in subsequent posts.  In the next post,  I'll look inot the LCD sub-assembly.


Friday, May 25, 2012

Laptop Disassembly - As complex as they get. Part 2


PART 2

Part 1 consisted of dismantling of the major components that made up the product architecture on the bottom half of the laptop.  This post will be a start of the dismantling of the subassembly components. I emphasize "start".



13.  Hard drive intact: underneath, all components soldered or bonded components
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14.  Hard drive dismantled: metal cover, PCB, drive and fasteners
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15.  Hard drive: PCB, as typical for PCBs, all soldered or bonded components
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16.  Hard drive dismantled (other sides): metal cover, PCB, drive and fasteners
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17.  Hard drive (other side): PCB
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 18.  Hard drive (other side): drive
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19.  Inside of bottom plastic cover of laptop, mostly one polymer, paper based shielding/cover
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20.  Main PCB intact, notice the high grade aluminum heat sink and conductive copper heat removal
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21.  Main PCB: aluminum and copper heatsinks etc. separated
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22.  Main PCB (other side), numerous soldered and bonded components
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23.  Aluminum heatsink, highly pure aluminum
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24.  Aluminum heatsink (other side)
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25.  Main PCB: close-up of RAM memory
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26.  Bottom  assembly, components dismantled and removed parts shown separated, parts from above photos:

     26.1 Panels removed and exposing under carriage (center and left)
          - upper control board and speaker grill panel (right)
          - mainboard: 
             ~ disk drive (top right)
             ~ main PCB (middle) 
          - hard drive (top left of PCB main assembly)
          - bottom plastic cover of laptop (left: gray rectangular plastic molded)
          - battery pack (bottom right)
          - hard drive panel (top middle left)
          - memory card panel (bottom middle left)
          - numerous fasteners
---



27.  Hard drive dismantled: inside
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28.  Hard drive dismantled: outside
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29.  Bottom cover of laptop: outside
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1.  (1st photo again) Not done yet by a long shot. Here, it looks so uncomplicated.
---


These are the same components (from Part 1) removed and separated from each other with their subassemblies taken apart. This is just for the bottom portion of the laptop.  After many dismantling efforts:

- Time in Part 1, average was 3min.  I could have been exact to the second, but in reality, it would vary. If you want specific times, see there many publications on it. There are 100s on:
www.ActiveDisassembly.com (publications) related to this topic and future technology in 'Design for Disassembly; (DfD).
  
- Time here in Part 2: 5min. As in Part 1., this is mainly due to the amount of machine screws and complexity. I had the proper tools and 2 power drills with correct bits in place. To get consistently under 5min would require mechanized or robotic systems. Alternatively DfD and www.ActiveDisassembly.com, which could do it in fractions of a second with batch processing.

Conclusions (similar issues as in Part 1)
Design issues:
- too many screws (dozens), more than in Part 1, in this next level of dismantling

- too many snap fits that make it hard not to break the subassemblies - snap fits are usually better than screws
- non-obvious disassembly 
- mixed materials
- complexity
- numerous brass captain bolts molded into injection molding
- non-standardized screws
- under spec polymer casings (warping, cracking and wear)
- glued labels
- too time-consuming and complex for repair (PCB and battery pack etc.)
  ~ batter pack is bonded to ensure closure, contains high grade materials
- too time-consuming for upgrade (memory board, hard drive etc.) 


Even with numerous snap fits, they were breakable and at times required cracking of the assembly in order to open parts apart. Overlapping of components was  still somewhat minimal as in Part 1. There are still many insulating materials mixed in with others.

I will go into the next level of detail in subsequent posts.  In the next post,  I'll finish the bottom half macro disassembly of its subassemblies.



Tuesday, May 22, 2012

Laptop Disassembly - As complex as they get.

I've taken 1000s of electronics apart in the last 20 years. These have all been the subject of 'Design for Disassembly' (DfD) study, from windup watches, automobiles to almost every time of electronic product you can think of.

This time, it's time to take apart the most complex laptop I've ever attempted. I'm going to analyze the parts and then model them and re-design it. I'll write up the development and apply a variety of 'Design for X' (DfX) strategies to it. I'll apply this same model to other products.

Here are is the test mule:



1. Outside casing intact: inside-top assembly
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2. Outside casing intact: front view open
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3. Outside casing intact: close-up of upper control board and speaker grill panel
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4. Outside casing: upper keyboard control panel removed
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5. Bottom casing: Removable panels and components removed:
     5.1 Battery pack spring clip and lock unsnapped open
          - no screws
     5.2 Hard drive panel unscrewed and unhinged
           - x1 machine screw, simple 3-pronged hinge and 5 snap fit release
     5.3 Memory card panel unscrewed and unhinged
          - x1 machine screw, simple 3-pronged hinge and 8 snap fit release release
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6. Upper control board and speaker grill panel:
     6.1 Panel removed
          - x24 snap fits
          - x4 female brass captive bolts 
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7. Under upper control board and speaker grill panel:
     7.1 Panel removed  exposing
          - speaker
          - manual volume controls
          - mode controls
          - power button (just under Speaker)


---





8. Under top PCB assembly, components still fastened but removed parts shown separated, parts from above photos:
     8.1 Panels removed and exposing under carriage
          - 
upper control board and speaker grill panel (top)
          - mainboard: 
             ~ disk drive (top left)
             ~ fan (top right)
             ~ main PCB (middle)
             ~ connection board (bottom left - green upside down 'L' under disk drive)
          - hard drive (bottom left of PCB main assembly)
          - bottom plastic cover of laptop (large silver rectangular plastic molded)
          - b
attery pack (bottom)
          - hard drive panel (bottom right )
          - memory card panel (bottom left)
---




9. Outside of bottom plastic cover of laptop 
    -  all pieces separated
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10. Under mainboard  close-up: 
      - disk drive (top left)
      - fan (top right)
      - main PCB (middle)
      - connection board (bottom left - green upside down 'L' under disk drive)
---



11. Inside of bottom plastic cover of laptop 
      -  all parts removed
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12. Hard drive 
     - removed
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These are all the main components removed and separated from each other.  The first time you disassemble the laptop it obviously takes a bit of time to get used to. After a lot of practice:

- Time: 3min.  This is mainly due to the amount of machine screws and complexity. It would be difficult to get under this 3min as I had the proper tools and 2 power drills with correct bits in place.


Conclusions

Design issues:
- too many screws (dozens)
- too many snap fits that break (dozens), snap fits are still preferable to screws.
- non-obvious disassembly 
- mixed materials
- complexity
- brass captain bolts molded into injection molding
- nonstandardized screws
- under spec polymer casings (warping, cracking and wear)
- glued labels
- too time-consuming and complex for repair (PCB and battery pack etc.)
- too time-consuming for upgrade (memory board, hard drive etc.)  

Some care in design had been taken into account since there were snap fits in places where previous designs might have had more screws and mixed material hinges. Overlapping of components was  somewhat minimal. There were, however, various insulating materials mixed in with other smaller, break to snap off components. I will go into further detail in subsequent posts.

In the next post, I will disassemble the components' subassemblies.